Job Title: Sr. Associate, Manufacturing Engineer- Semiconductor Process Engineer-Wirebond/Assembly (Mason, OH)
Job Code: 17152
Job Location: Mason, OH
Schedule: 9/80; every other Friday off
Job Description:
L3Harris Technologies is seeking a Semiconductor Process Engineer for the Focal Plane Array team at our Mason, OH location. As a Semiconductor Process Engineer, you will support a variety of wafer/die fabrication tools and processes, perform data analysis for development and production work, identify process issues and process optimization opportunities, perform root cause analysis and drive mitigation strategies, perform qualification activities for new processes and tools, and provide sustaining engineering support in a manufacturing area. You will have regular interactions with equipment vendors, operations management, equipment maintenance and a development engineering teams.
This particular role is for the wire bond/assembly area for Focal Plane Arrays
Essential Functions:
- Qualify, setup, and operate semiconductor wire bond equipment in a low volume manufacturing environment
- Qualify, setup, and operate pick and place equipment in a low volume manufacturing environment
- Perform DOEs and process verification to bring new tools and processes online
- Develop, optimize, and own wafer processes to drive device performance and yield improvement; create process documentation
- Create and routinely monitor statistical process control (SPC) for production processes; identify process drifts and catch potential excursions
- Document out of control action plans (OCAPs) for processes failing SPC limits
- Identify process and/or equipment issues; Lead investigation efforts for issues related to wafer/die processes
- Recommend improvements for efficiency, cost, reliability and quality of existing products; Work with related engineering teams to drive, test, and implement approved plans
- Perform on-the-job training for incoming new hires as the team grows
- Maintain a safe and organized work environment
Qualifications:
- Bachelor’s Degree and a minimum of 0-1 years of prior related experience.
- Experience or more in semiconductor wire bond processing operations.
- Experience or more in III-V semiconductor wafer/die processing.
Preferred Additional Skills:
- Experience in automated wire bonding and/or pick and place programing.
- Exceptional organizational, verbal, and written communication skills
- Proficient skills in statistical data analysist software(Minitab, JMP, etc)
- Strong sense of responsibility, ownership, and follow-through
- Must be a team player, pro-active, and customer-oriented with a sense of urgency to accomplish a given task or goal
- Ability to train technicians and engineers on processes and equipment used in area of ownership
- Lean Six Sigma Certification
- Previous experience working in a Class 100 cleanroom or similar
- Experience in implementing lean/six sigma techniques (FMEA, DFMA, DTC, DOE, and root cause/corrective action analysis)
